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From 2D to 3D. From limits to possibilities. For decades, progress in electronics meant shrinking transistors on a flat wafer. That era is reaching its limits. The next leap is 3D: chips stacked on chips, dies combined into one package. But connecting these complex 3D structures demands a precision and speed conventional techniques cannot deliver. This is where FononTech comes in. Impulse Printing™ is the enabler: contactless printing of the finest interconnects, at production speed, on complex 3D topographies. The industry is moving into the third dimension. FononTech is making it manufacturable.
